Faculty Information - Al Farisi Muhammad Salman |

Al Farisi Muhammad Salman

Department / Course Hiroshima City University Graduate School Graduate School of Information Sciences Major in Biomedical Information Sciences

Hiroshima City University Faculty of Information Sciences Department of Biomedical Information Sciences

Job Lecturer

Academic conference presentation
2024/03	Facile Packaging for Fiber-Shaped Flexible MEMS Thermal Accelerometer (11th IEEE International Symposium on Inertial Sensors & Systems (INERTIAL 2024))
2023/11	Embedding Airflow Sensing Function in Balloon Catheter for Respiration Measurement in Bronchus Region Inside Lung (36th Int. Microprocesses and Nanotechnology Conf. (MNC 2023))
2023/11	Laser Processing for Time Response Enhancement of Flexible MEMS Thermal Sensors (36th Int. Microprocesses and Nanotechnology Conf. (MNC 2023))
2023/11	Tracheal Intubation Tube with Embedded Flow Sensor for Respiration and Heartbeat Monitoring During Canine Tartar Removal (36th Int. Microprocesses and Nanotechnology Conf. (MNC 2023))
2023/11	Trials on MEMS sensor utilization on 3D printed intravascular flow model (12th Asian-Pacific Conference on Biomechanics (AP-Biomech 2023))
2023/11	Pressure and airflow simultaneous measurement system based on pitot tube for in-situ evaluation inside lung (40th Sensor Symposium on Sensors, Micromachines and Applied Systems)
2023/11	Quantitative calibration method for wearable vital sign sensor using airflow at mouth (40th Sensor Symposium on Sensors, Micromachines and Applied Systems)
2023/11	Intubation tube with embedded airflow sensor for respiration monitoring during canine tartar removal (40th Sensor Symposium on Sensors, Micromachines and Applied Systems)
2023/11	Development of balloon catheter airflow sensor for respiration measurement in bronchus region inside lung (14th Symp. Micro-Nano Science and Technology)
2023/11	Development of physical-chemical sensor system for lung tissue function assessment (40th Sensor Symposium on Sensors, Micromachines and Applied Systems)
2023/08	Development of a Flow Simulator for Evaluation of Hemodynamics Computational Simulation (2023 8th Int. Conf. Instrumentation, Control, and Automation (ICA))
2023/06	Calibration method for wearable sensor using airflow at mouth for quantitative monitoring of respiration and heartbeat (2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers))
2023/06	Future Visions for Transducers Fabrication (2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers))
2023/06	In-tube-center packaging of flexible MEMS airflow-rate sensor and its sensitivity enhancement (2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers))
2023/06	Simultaneous airflow and pressure measurements based on pitot tube for evaluation of expired air inside lung airway (2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers))
2022/11	Development Of Medical Wireless MEMS Sensor System For Vital Sign Measurement (the 39th Sensor Symposium on Sensors, Micromachines and Applied Systems)
2022/06	Wireless MEMS Thermal Flow Sensor System Integrated On Medical Mask For Emergency Medical Treatment (10th Asia-Pacific Conference of Transducers and Micro-Nano Technology 2022 (APCOT 2022))
2021/11	Dual-Mass Resonator with Dynamically Balanced Structure for Roll/Pitch Rate Integrating Gyroscope (2021 IEEE Sensors)
2021/06	Fully CMOS-compatible wafer bonding based on press marking using thick electroplated aluminum (2021 21th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers))
2021/04	Electrochemically Deposited Aluminum for MEMS Thermal Actuator (2021 Smart Systems Integration (SSI))
2020/10	Influence of Additive Inclusion on Hardness of Electroplated Al Film with Nanometer-Level Flatness from Chloroaluminate Ionic Liquid (Pacific Rim Meeting on Electrochemical & Solid State Science (PRiME) 2020)
2020/10	Wafer-level thermocompression bonding using electroplated Al thin film
2020/07	Electromagnetically Actuated Quartz Glass Ring Resonator for Mode Matched Gyroscope
2020/03	Out-of-plane resonator for roll/pitch rate integrated gyroscope with dynamically balanced dual-mass
2020/03	Roll/Pitch Rate Integrating MEMS Gyroscope Using Dynamically Balanced Dual-Mass Resonator (2020 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL))
2019/11	Dynamically Balanced Out-of-Plane Resonator for Roll/Pitch Rate Integrating Gyroscope
2019/11	Fabrication Method of Micromachined Quartz Resonator Using Temporal Au Supporting Structures
2019/11	Investigation of Mechanical and Electrical Properties of Electroplated Aluminum Film from AlCl3-[EMIm]Cl Ionic Liquid
2019/08	Investigation on Relief Supplies for Home Evacuees after the Great East Japan Earthquake —Case of Iwaki City, Fukushima Prefecture—
2019/01	Sealed cavity pressure evaluation from 1 Pa to over 10 kPa using thin diaphragm for MEMS vacuum packaging (2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS))
2018/12	Investigation of effective education for disaster mitigation by utilizing liquefaction experiment
2018/12	Support activities aimed at dissemination of voluntary and sustainable education for disaster mitigation: an example of the Disaster Mitigation Action Card Game
2018/05	Education for Disaster Mitigation by Utilizing Liquefaction Experiment (Japan Geoscience Union (JpGU) Meeting 2018)
2018/04	Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC))
2017/12	Evaluation of the Disaster Mitigation Action Card Game for International Students in Japan
2017/06	250°C wafer-level vacuum sealing using electroplated copper bonding frame planarized by fly-cutting (19th International Conference on Solid-State Sensors Actuators and Microsystems (TRANSDUCERS))
2017/02	Grain refining of metal surface by mechanical cutting for low-temperature wafer-level vacuum bonding (2nd USTB-TU Joint Workshop on Advanced Materials and Manufacture)
2016/04	Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps (11th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS))