Faculty Information
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Al Farisi Muhammad Salman
Department / Course
Hiroshima City University Graduate School Graduate School of Information Sciences Major in Biomedical Information Sciences
Hiroshima City University Faculty of Information Sciences Department of Biomedical Information Sciences
Job
Lecturer
Book and thesis
Papers
Laser Ablation for Time Response Suppression of Flexible MEMS Thermal Sensors IEEE Sensors Journal (Co-authored) 2025
Papers
Investigation of Calibration Methodology Using Mouth Airflow for Wearable Sensor Toward Quantitative Monitoring of Respiration IEEJ Transactions on Electrical and Electronic Engineering 19 (5),pp.800-806 (Co-authored) 2024
Papers
Non-contact sensor module for rapid detection of extravasation during intravenous drug administration Biomedical Microdevices 26,pp.44 (Co-authored) 2024
Papers
Pitot Tube Sensor Probe System for Simultaneous Airflow and Pressure Measurement of Expiration Inside Pulmonary Airway IEEJ Transactions on Electrical and Electronic Engineering 19 (5),pp.807-813 (Co-authored) 2024
Papers
Proof-of-Concept Quantitative Monitoring of Respiration Using Low-Energy Wearable Piezoelectric Thread Electronics 13 (23),pp.4577 (Co-authored) 2024
Papers
Tracheal Intubation Tube with Embedded Airflow Sensor for Respiration Monitoring During Canine Tartar Removal IEEJ Transactions on Sensors and Micromachines,pp.390-395 (Co-authored) 2024
Papers
Analysis of Airstream Inside the Slip Joint of Tracheal Intubation Tube for Breathing Measurement IEEJ Transactions on Sensors and Micromachines 143 (1),pp.6-12 (Co-authored) 2023
Papers
Facile In-Tube-Center Packaging of Flexible Airflow Rate Microsensor for Simultaneous Respiration and Heartbeat Measurement IEEE Sensors Journal 23 (12),pp.12626-12633 (Co-authored) 2023
Papers
Facile Packaging for Fiber-Shaped Flexible MEMS Thermal Accelerometer IEEE Sensors Letters 7 (11),pp.2504704 (Co-authored) 2023
Papers
Sensitivity Enhancement of Tube-Integrated MEMS Flow Sensor using Flexible Copper on Polyimide Substrate Micromachines 14 (1),pp.42 (Co-authored) 2023
Papers
Advancements in MEMS technology for medical applications: microneedles and miniaturized sensors Japanese Journal of Applied Physics 61,pp.SA0803 (Co-authored) 2022
Papers
Electroplated Al Press Marking for Wafer-Level Bonding Micromachines 13 (8),pp.1221 (Co-authored) 2022
Papers
Mechanical hardening of electrochemically deposited aluminum from chloroaluminate ionic liquid Scripta Materialia 213,pp.114599 (Co-authored) 2022
Papers
Fabrication Method of Micromachined Quartz Glass Resonator Using Sacrificial Supporting Structures Sensors and Actuators A: Physical 305,pp.111922 (Co-authored) 2020
Papers
Tailoring material properties of electrochemically deposited Al film from chloroaluminate ionic liquid for microsystem technology using pulsed deposition Sensors and Actuators A: Physical 316,pp.112384 (Co-authored) 2020
Papers
Zero-Balance Method for Evaluation of Sealed Cavity Pressure Down to Single Digit Pa Using Thin Silicon Diaphragm Journal of Microelectromechanical Systems 29 (3),pp.418-426 (Co-authored) 2020
Papers
Investigation of effective education for disaster mitigation by utilizing liquefaction experiment Tohoku Journal of Natural Disaster Sciences,pp.203-208 (Co-authored) 2019
Papers
Support activities aimed at dissemination of voluntary and sustainable education for disaster mitigation: an example of the Disaster Mitigation Action Card Game Tohoku Journal of Natural Disaster Sciences,pp.209-214 (Co-authored) 2019
Papers
Investigation on Relief Supplies for Home Evacuees after the Great East Japan Earthquake －Case of Iwaki City, Fukushima Prefecture Coll. Great East J. Earthquake, Inst. Soc. Safety Sci.,pp.19-22 (Co-authored) 2019
Papers
Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid towards Microsystems Application Micromachines 9 (11),pp.589 (Co-authored) 2018
Papers
Evaluation of the Disaster Mitigation Action Card Game for International Students in Japan Tohoku Journal of Natural Disaster Sciences 54,pp.279-284 (Co-authored) 2018
Papers
Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging Sensors and Actuators A: Physical 279,pp.671-679 (Co-authored) 2018
Papers
Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting Journal of Micromechanics and Microengineering 27 (1),pp.015029 (Co-authored) 2017
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